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Copper Heat Pipe with Phase Change Material

Metalli's liquid cooling plate technologies include vacuum or controlled atomsphere brazed cold plate, Friction Stir Welded (FSW) performance-fin cold plates, flat tube cold plates, press copper tubed cold plates, copper cold plates.

Metalli's cooling paltes are widely used in power electronics, ev battery, data center, medical equipment, lasers and wind turbines.

All prodcuts can be customized as your requirements. Support OEM/ODM. 100% meets the standards of GB, SGS, CE.
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Product name : copper heat pipe heat sink with phase change material



                                       PRODUCT DESCRIPTION

NO.

ITEM

DESCRIPTION

1

Material

Aluminum alloy 6000 series or copper T2

2

Section Dimension (W*H)

Up to 500*120 mm

3

Fin thickness

0.2 to 1 mm

4

Fin spacing

Minimum 1 mm

5

Cooling Capacity

Up to 2000 W

6

Flatness for mounting surface

0.15 mm

7

Surface roughness for mounting

3.2 um

8

Manufacturing Method

CNC machining, extrusion and bonding

9

Cooling Method

Water cooling

10

Surface Finish

Mill finish

11

Warranty time

1 year

12

Place of Region

Jiangsu province of China

13

Reference Standard

GB/T 3190-2008,ISO 2768


Metalli’s heat sink technologies include

◆ CNC machined aluminum fins heat sink

◆ Skived aluminum heat sink

◆ Vacuum brazed bonded aluminum fins heat sink

◆ Extruded aluminum heat sink

◆ Die casting aluminum heat sink

◆ Epoxy glued bonded aluminum fin heat sink

Copper heat sink

▲ Copper heat sink


Metalli’s manufacture a wide range of heat sink include

●    Cpu gpu ram heat sink

●    Led aluminum heat sink

●    Heat sink aluminum enclosure

●    Copper heat pipe heat sink

●    Liquid water cooling heat sink

●    Inverter Aluminum Heatsink

● Other custom heat sinks

cnc machined skived aluminum heat sink

▲ Skived aluminum heat sink with copper heat pipe


Brief of heat sink

A heat sink (also commonly spelled heatsink) is a passive heat exchanger that transfers the heat generated by an electronic or a mechanical device to a fluid medium, often air or a liquid coolant, where it is dissipated away from the device, thereby allowing regulation of the device's temperature. In computers, heat sinks are used to cool CPUs, GPUs, and some chipsets and RAM modules. Heat sinks are used with high-power semiconductor devices such as power transistors and optoelectronics such as lasers and light-emitting diodes (LEDs), where the heat dissipation ability of the component itself is insufficient to moderate its temperature.


A heat sink is designed to maximize its surface area in contact with the cooling medium surrounding it, such as the air. Air velocity, choice of material, protrusion design and surface treatment are factors that affect the performance of a heat sink. Heat sink attachment methods and thermal interface materials also affect the die temperature of the integrated circuit. Thermal adhesive or thermal paste improve the heat sink's performance by filling air gaps between the heat sink and the heat spreader on the device. A heat sink is usually made out of aluminum or copper


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NANJING METALLI INDUSTRIAL CO., LIMITED

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