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Product name : aluminum bonded fin heat sink
PRODUCT DESCRIPTION | ||
NO. | ITEM | DESCRIPTION |
1 | Material | Aluminum alloy 6060,6061,6063,T3,T5 |
2 | Dimension (Diameter*H) | Up to Φ200*120 mm |
3 | Fin Spacing | Minimum 2.5 mm |
4 | Fin thickness | Minimum 1.5 mm |
5 | Cooling Capacity | Up to 600 W |
6 | Flatness for mounting surface | 0.15 mm |
7 | Manufacturing Method | Aluminum extrusion PLUS further cnc machining if needed |
8 | Cooling Method | Natural or forced air cooling |
9 | Surface Finish | Mill finish,anodization,painting or powder coating |
10 | Warranty time | 1 year |
11 | Place of Region | Jiangsu province of China |
12 | Reference Standard | GB/T 3190-2008,GB/T 14846-2008,ISO 2768 |
Metalli's heat sink technologies include:
CNC machined aluminum fin heat sinks
Skived aluminum heat sinks
Vacuum brazed bonded aluminum fin heat sinks
Extruded aluminum heat sinks
Die-cast aluminum heat sinks
Epoxy-glued bonded aluminum fin heat sinks
▲ Copper heat sink
Metalli manufactures a wide range of heat sinks, including:
CPU, GPU, and RAM heat sinks
LED aluminum heat sinks
Heat sink aluminum enclosures
Copper heat pipe heat sinks
Liquid cooling heat sinks
Inverter aluminum heat sinks
Other custom heat sinks
▲ Skived aluminum heat sink with copper heat pipe
A heat sink is a passive heat exchanger that transfers heat generated by an electronic or mechanical device to a fluid medium, such as air or liquid coolant, where the heat is dissipated, helping to regulate the device's temperature. In computers, heat sinks are commonly used to cool components like CPUs, GPUs, chipsets, and RAM modules. They are also essential for high-power semiconductor devices, including power transistors and optoelectronics such as lasers and LEDs, where the component's own heat dissipation is insufficient to maintain safe temperatures.
Heat sinks are designed to maximize the surface area in contact with the surrounding cooling medium, typically air. Factors like air velocity, material selection, fin or protrusion design, and surface treatment all influence heat sink performance. The method of attaching the heat sink and using thermal interface materials, such as thermal paste or adhesive, also significantly affects the temperature of the integrated circuit. Aluminum and copper are the most common materials used in heat sink construction due to their excellent thermal conductivity.
Product name : aluminum bonded fin heat sink
PRODUCT DESCRIPTION | ||
NO. | ITEM | DESCRIPTION |
1 | Material | Aluminum alloy 6060,6061,6063,T3,T5 |
2 | Dimension (Diameter*H) | Up to Φ200*120 mm |
3 | Fin Spacing | Minimum 2.5 mm |
4 | Fin thickness | Minimum 1.5 mm |
5 | Cooling Capacity | Up to 600 W |
6 | Flatness for mounting surface | 0.15 mm |
7 | Manufacturing Method | Aluminum extrusion PLUS further cnc machining if needed |
8 | Cooling Method | Natural or forced air cooling |
9 | Surface Finish | Mill finish,anodization,painting or powder coating |
10 | Warranty time | 1 year |
11 | Place of Region | Jiangsu province of China |
12 | Reference Standard | GB/T 3190-2008,GB/T 14846-2008,ISO 2768 |
Metalli's heat sink technologies include:
CNC machined aluminum fin heat sinks
Skived aluminum heat sinks
Vacuum brazed bonded aluminum fin heat sinks
Extruded aluminum heat sinks
Die-cast aluminum heat sinks
Epoxy-glued bonded aluminum fin heat sinks
▲ Copper heat sink
Metalli manufactures a wide range of heat sinks, including:
CPU, GPU, and RAM heat sinks
LED aluminum heat sinks
Heat sink aluminum enclosures
Copper heat pipe heat sinks
Liquid cooling heat sinks
Inverter aluminum heat sinks
Other custom heat sinks
▲ Skived aluminum heat sink with copper heat pipe
A heat sink is a passive heat exchanger that transfers heat generated by an electronic or mechanical device to a fluid medium, such as air or liquid coolant, where the heat is dissipated, helping to regulate the device's temperature. In computers, heat sinks are commonly used to cool components like CPUs, GPUs, chipsets, and RAM modules. They are also essential for high-power semiconductor devices, including power transistors and optoelectronics such as lasers and LEDs, where the component's own heat dissipation is insufficient to maintain safe temperatures.
Heat sinks are designed to maximize the surface area in contact with the surrounding cooling medium, typically air. Factors like air velocity, material selection, fin or protrusion design, and surface treatment all influence heat sink performance. The method of attaching the heat sink and using thermal interface materials, such as thermal paste or adhesive, also significantly affects the temperature of the integrated circuit. Aluminum and copper are the most common materials used in heat sink construction due to their excellent thermal conductivity.
