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English  |
PRODUCT DESCRIPTION | ||
NO. | ITEM | DESCRIPTION |
1 | Material | Casting aluminum like ADC12,A380 |
2 | Dimension (L*W*H) | Up to 300*300*150 mm |
3 | Fin thickness | Above 1.5 mm |
4 | Fin spacing | Minimum 2.0 mm |
5 | Cooling Capacity | Up to 500 W |
6 | Flatness for mounting surface | 0.2 mm |
7 | Surface roughness for mounting | 3.2 um |
8 | Manufacturing Method | Aluminum die casting |
9 | Cooling Method | Natural or forced air cooling |
10 | Surface Finish | Sand blasting, painting or powder coating |
11 | Warranty time | 1 year |
12 | Place of Region | Jiangsu province of China |
13 | Reference Standard | GB/T 3190-2008,ISO 2768 |
Metalli’s heat sink technologies include
◆ CNC machined aluminum fins heat sink
◆ Skived aluminum heat sink
◆ Vacuum brazed bonded aluminum fins heat sink
◆ Extruded aluminum heat sink
◆ Die casting aluminum heat sink
◆ Epoxy glued bonded aluminum fin heat sink
▲ Copper heat sink
Metalli’s manufacture a wide range of heat sink include
● Cpu gpu ram heat sink
● Led aluminum heat sink
● Heat sink aluminum enclosure
● Copper heat pipe heat sink
● Liquid water cooling heat sink
● Inverter Aluminum Heatsink
● Other custom heat sinks
▲ Skived aluminum heat sink with copper heat pipe
Brief of heat sink
Heat sink is a device that helps regulate the temperature of electronic or mechanical devices by transferring the heat they generate to a fluid medium, like air or liquid coolant. This process helps dissipate the heat away from the device, preventing it from overheating.
Heat sinks are commonly used in computers to cool CPUs, GPUs, chipsets, and RAM modules. They are also used in high-power semiconductor devices like power transistors, as well as optoelectronics like lasers and LEDs.
The effectiveness of a heat sink depends on factors like its surface area, material, design, and attachment method. Using thermal adhesive or paste can further improve its performance by filling gaps between the heat sink and the device.
PRODUCT DESCRIPTION | ||
NO. | ITEM | DESCRIPTION |
1 | Material | Casting aluminum like ADC12,A380 |
2 | Dimension (L*W*H) | Up to 300*300*150 mm |
3 | Fin thickness | Above 1.5 mm |
4 | Fin spacing | Minimum 2.0 mm |
5 | Cooling Capacity | Up to 500 W |
6 | Flatness for mounting surface | 0.2 mm |
7 | Surface roughness for mounting | 3.2 um |
8 | Manufacturing Method | Aluminum die casting |
9 | Cooling Method | Natural or forced air cooling |
10 | Surface Finish | Sand blasting, painting or powder coating |
11 | Warranty time | 1 year |
12 | Place of Region | Jiangsu province of China |
13 | Reference Standard | GB/T 3190-2008,ISO 2768 |
Metalli’s heat sink technologies include
◆ CNC machined aluminum fins heat sink
◆ Skived aluminum heat sink
◆ Vacuum brazed bonded aluminum fins heat sink
◆ Extruded aluminum heat sink
◆ Die casting aluminum heat sink
◆ Epoxy glued bonded aluminum fin heat sink
▲ Copper heat sink
Metalli’s manufacture a wide range of heat sink include
● Cpu gpu ram heat sink
● Led aluminum heat sink
● Heat sink aluminum enclosure
● Copper heat pipe heat sink
● Liquid water cooling heat sink
● Inverter Aluminum Heatsink
● Other custom heat sinks
▲ Skived aluminum heat sink with copper heat pipe
Brief of heat sink
Heat sink is a device that helps regulate the temperature of electronic or mechanical devices by transferring the heat they generate to a fluid medium, like air or liquid coolant. This process helps dissipate the heat away from the device, preventing it from overheating.
Heat sinks are commonly used in computers to cool CPUs, GPUs, chipsets, and RAM modules. They are also used in high-power semiconductor devices like power transistors, as well as optoelectronics like lasers and LEDs.
The effectiveness of a heat sink depends on factors like its surface area, material, design, and attachment method. Using thermal adhesive or paste can further improve its performance by filling gaps between the heat sink and the device.
